The prime cleanup contractor for the Central Plateau at the Department of Energy’s Hanford Site in Washington state is accepting expressions of interest from potential manufacturers of an ion-exchange system for treatment of contaminated groundwater.
The selected subcontractor would design, produce, and submit the system for extraction of uranium and technetium-99 for the pump-and-treat facility in Hanford’s 200 West Area, according to a June 18 sources sought notice from CH2M Hill Plateau Remediation Co. (CHPRC).
The facility in 200 West is the largest of the pump-and-treat plants at Hanford, home to a massive environmental remediation project following decades of plutonium production for the U.S. nuclear arsenal. Roughly 200 square kilometers of groundwater at the site has groundwater contaminated with radioactive materials and chemicals. Some groundwater plumes are flowing toward the Columbia River, CHPRC said. Pump-and-treat systems use wells to collect the groundwater, which is then decontaminated and replaced back into the aquifer.
CH2M Hill Plateau Remediation said the new document is not a formal request for proposals, though would-be bidders must respond to this notice to be considered later during the official procurement.
Firms have until 4 p.m. Pacific time on July 1 to submit a capability statement including the following information: company name, address, email address, website address, telephone number, and business size standard; a short explanation of the company’s system/technical approach; comments on the technical documents attached to the sources sought notice; a “rough order of magnitude” (ROM) expense assessment for all parts and services involved in the subcontract; a ROM timeline and conditions for adhering to the schedule; and a short rundown of the company’s quality program.
Inquiries regarding the notice should be directed to Joan Howard, manager of the CHPRC construction services contracts team, by email at [email protected] or via mail at P.O. Box 1600, M/S H8-42, Richland, WA 99352.
